par Naeim, Mohamed 
;Biswas, Dwaipayan;Dai, Yun;Zografos, Odysseas;Oprins, Herman;Plas, Geert Van Der;Kao, C.T.;Chen, Pinhong;Milojevic, Dragomir
Référence IEEE Journal on Emerging and Selected Topics in Circuits and Systems
Publication Publié, 2025-07-22
;Biswas, Dwaipayan;Dai, Yun;Zografos, Odysseas;Oprins, Herman;Plas, Geert Van Der;Kao, C.T.;Chen, Pinhong;Milojevic, Dragomir Référence IEEE Journal on Emerging and Selected Topics in Circuits and Systems
Publication Publié, 2025-07-22
Article révisé par les pairs
| Titre: |
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| Auteur: | Naeim, Mohamed; Biswas, Dwaipayan; Dai, Yun; Zografos, Odysseas; Oprins, Herman; Plas, Geert Van Der; Kao, C.T.; Chen, Pinhong; Milojevic, Dragomir |
| Informations sur la publication: | IEEE Journal on Emerging and Selected Topics in Circuits and Systems |
| Statut de publication: | Publié, 2025-07-22 |
| Sujet CREF: | Physique de l'état condense [struct., électronique, etc.] |
| Physique de l'état condense [struct., propr. thermiques, etc.] | |
| Physique de l'état condense [supraconducteur] | |
| Mots-clés: | 3D Integration |
| 3D-IC | |
| electrothermal coupling | |
| IR-drop | |
| Layout | |
| leakage power | |
| Power-temperature co-simulation | |
| PPAT | |
| temperature | |
| thermal analysis | |
| Note générale: | SCOPUS: ar.j |
| Langue: | Anglais |
| Identificateurs: | urn:issn:2156-3357 |
| info:doi/10.1109/JETCAS.2025.3591727 | |
| info:scp/105012630672 |
