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3D-Convolution Based Fast Transient Thermal Model for 3D Integrated Circuits: Methodology and Applications

par Maggioni, Federica Lidia Teresa;Oprins, Herman;Milojevic, Dragomir ;Beyne, Eric;Wolf, Ingrid De;Baelmans, Martine
Référence Thermal Measurement, Modeling Management Symposium (SEMI-THERM), 2015 31st,, page (107-112)
Publication Publié, 2015-05-04

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Titre:	3D-Convolution Based Fast Transient Thermal Model for 3D Integrated Circuits: Methodology and Applications
Auteur:	Maggioni, Federica Lidia Teresa; Oprins, Herman; Milojevic, Dragomir; Beyne, Eric; Wolf, Ingrid De; Baelmans, Martine
Informations sur la publication:	Thermal Measurement, Modeling Management Symposium (SEMI-THERM), 2015 31st,, page (107-112)
Statut de publication:	Publié, 2015-05-04
Sujet CREF:	Technol. des composantes électroniques [microélectronique]
Mots-clés:	3D IC thermal modelling
Langue:	Anglais
Identificateurs:	info:doi/10.1109/SEMI-THERM.2015.7100148