Communications publiées lors de congrès ou colloques nationaux et internationaux (66)
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Milojevic, D., Marchal, P., Marinissen, E. J., Plas, G. V. D., Verkest, D. D., & Beyne, E. (2013). Design Issues in Heterogeneous 3D/2.5D Integration. ASP-DAC26.
Casale-Rossi, M., Leduc, P., De Micheli, G., Blouet, P., Farley, B., Fontanelli, A., Milojevic, D., & Smith, S. G. (2013). Will 3D-IC remain a technology of the future; Even in the future? Design, Automation Test in Europe Conference Exhibition (DATE), 2013 (pp. 1526-1530). doi:10.7873/DATE.2013.31029.
Milojevic, D., Idgunji, S., Jevdjic, D., Ozer, E., Lotfi-Kamran, P., Panteli, A., Prodromou, A., Nicopoulos, C., Hardy, D., Falsafi, B., & Sazeides., Y. (2012). Thermal Characterization of Cloud Workloads on a Power-Efficient Server-on-Chip. 30th Intl. IEEE Conference on Computer Design (ICCD)31.
Eneman, G., Cho, J., Moroz, V., Milojevic, D., Choi, M., De Meyer, K., Mercha, A., Beyne, E., Hoffmann, T., & Van der Plas, G. (2011). An Analytical Compact Model for Estimation of Stress in Multiple Through-Silicon Via Configurations. Design, Automation & Test in Europe Design, Automation & Test in Europe(14-18 March 2011: Grenoble, France)