Articles dans des revues avec comité de lecture (41)
  1. 6. Sisto, G., Chen, R., Chou, R., Van Der Plas, G., Beyne, E., Metcalfe, R., & Milojevic, D. (2021). Design and Sign-off Methodologies for Wafer-To-Wafer Bonded 3D-ICs at Advanced Nodes (invited). International Workshop on System Level Interconnect Prediction, SLIP, 2021-November, 17-23. doi:10.1109/SLIP52707.2021.00011
  2. 7. Oprins, H., Milojevic, D., Van Der Plas, G., & Beyne, E. (2021). Thermal analysis of 3D functional partitioning for high-performance systems. InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM, 2021-June, 145-153. doi:10.1109/ITherm51669.2021.9503209
  3. 8. Beyne, E., Milojevic, D., Van Der Plas, G., & Beyer, G. (2021). 3D SoC integration, beyond 2.5D chiplets. Technical Digest - International Electron Devices Meeting, IEDM, 2021-December, 3.6.1-3.6.4. doi:10.1109/IEDM19574.2021.9720614
  4. 9. Chen, R., Sisto, G., Jourdain, A., Hiblot, G., Stucchi, M., Kakarla, N., Chehab, B., Salahuddin, S. M., Schleicher, F., Veloso, A., Hellings, G., Weckx, P., Milojevic, D., Van Der Plas, G., Ryckaert, J., & Beyne, E. (2021). Design and Optimization of SRAM Macro and Logic Using Backside Interconnects at 2nm node. Technical Digest - International Electron Devices Meeting, IEDM, 2021-December, 22.4.1-22.4.4. doi:10.1109/IEDM19574.2021.9720528
  5. 10. Milojevic, D., Sisto, G., Van Der Plas, G., & Beyne, E. (2021). Fine-pitch 3D system integration and advanced CMOS nodes: Technology and system design perspective. Proceedings of SPIE - The International Society for Optical Engineering, 11614, 116140H. doi:10.1117/12.2584532
  6. 11. Agnesina, A., Brunion, M., Kim, J., García-Ortiz, A., Milojevic, D., Catthoor, F., Perumkunnil, M., & Lim, S. K. (2021). Power, Performance, Area and Cost Analysis of Memory-on-Logic Face-to-Face Bonded 3D Processor Designs. Proceedings - International Symposium on Low Power Electronics and Design, 2021-July, 9502475. doi:10.1109/ISLPED52811.2021.9502475
  7. 12. Zhu, L., Bamberg, L., Pentapati, S. S. K., Chang, K., Catthoor, F., Milojevic, D., Komalan, M., Cline, B., Sinha, S., Xu, X., García-Ortiz, A., & Lim, S. K. (2021). High-Performance Logic-on-Memory Monolithic 3-D IC Designs for Arm Cortex-A Processors. IEEE transactions on very large scale integration (VLSI) systems, 29(6), 9420273, 1152-1163. doi:10.1109/TVLSI.2021.3073070
  8. 13. Sharma, G., Bousdras, G., Ellinidou, S., Markowitch, O., Dricot, J.-M., & Milojevic, D. (2021). Exploring the security landscape: NoC-based MPSoC to Cloud-of-Chips. Microprocessors and microsystems, 103963. doi:10.1016/j.micpro.2021.103963
  9. 14. Chen, R., Weckx, P., Salahuddin, S. M., Kim, S.-W., Sisto, G., Van Der Plas, G., Stucchi, M., Baert, R., Debacker, P., Na, M.-H., Ryckaert, J., Milojevic, D., & Beyne, E. (2020). 3D-optimized SRAM macro design and application to memory-on-logic 3D-IC at advanced nodes. Technical Digest - International Electron Devices Meeting, IEDM, 2020-December, 9371905, 15.2.1-15.2.4. doi:10.1109/IEDM13553.2020.9371905
  10. 15. Perumkunnil, M., Yasin, F., Rao, S., Salahuddin, S. M., Milojevic, D., Van Der Plas, G., Ryckaert, J., Beyne, E., Furnemont, A., & Kar, G. S. (2020). System exploration and technology demonstration of 3D Wafer-to-Wafer integrated STT-MRAM based caches for advanced Mobile SoCs. Technical Digest - International Electron Devices Meeting, IEDM, 2020-December, 9372046, 15.4.1-15.4.4. doi:10.1109/IEDM13553.2020.9372046
  11. 16. Milojevic, D., Beyne, E., Van Der Plas, G., Wang, J. J., & Debacker, P. (2020). Cost-performance optimization of fine-pitch W2W bonding: Functional system partitioning with heterogeneous FEOL/BEOL configurations. Proceedings of SPIE - The International Society for Optical Engineering, 11328, 113280R. doi:10.1117/12.2552036
  12. 17. Zhu, L., Bamberg, L., Agnesina, A., Catthoor, F., Milojevic, D., Komalan, M., Ryckaert, J., García-Ortiz, A., & Lim, S. K. (2020). Heterogeneous 3D Integration for a RISC-V System with STT-MRAM. I E E E Computer Architecture Letters, 19(1), 9086777, 51-54. doi:10.1109/LCA.2020.2992644
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