Communications publiées lors de congrès ou colloques nationaux et internationaux (66)
  1. 13. Ku, B. W., Debacker, P., Milojevic, D., Raghavan, P., Verkest, D., Thean, A., & Lim, S. K. (2016). Physical Design Solutions to Tackle FEOL/BEOL Degradation in Gate-level Monolithic 3D ICs. In Proceedings of the 2016 International Symposium on Low Power Electronics and Design (pp. 76-81). (ISLPED '16). ACM. doi:10.1145/2934583.2934622
  2. 14. Palomar, O., Rethinagiri, S., Yalcin, G., Titos-Gil, R., Prieto, P., Torrella, E., Unsal, O., Cristal, A., Felber, P., Sobe, A., Hayduk, Y., Kurpicz, M., Fetzer, C., Knauth, T., Schneegass, M., Struckmeier, J., & Milojevic, D. (2016). Energy Minimization at All Layers of the Data Center: The ParaDIME Project. In Proceedings of the 2016 Conference on Design, Automation AND Test in Europe (pp. 684-689). (DATE '16). Dresden, Germany: EDA Consortium.
  3. 15. Yalcin, G., Rethinagiri, S., Palomar, O., Unsal, O., Cristal, A., & Milojevic, D. (2016). Exploring Energy Reduction in Future Technology Nodes via Voltage Scaling with Application to 10nm. 2016 24th Euromicro International Conference on Parallel, Distributed, and Network-Based Processing (PDP) (pp. 184-191). doi:10.1109/PDP.2016.108
  4. 16. Yalcin, G., Rethinagiri, S. K., Palomar, O., Unsal, O., Cristal, A., & Milojevic, D. (2016). Exploring Energy Reduction in n10 Future Nodes via Voltage Scaling. 24th Euromicro International Conference on Parallel, Distributed, and Network-Based Processing (PDP 2016) doi:10.1109/PDP.2016.108
  5. 17. Palomar, O., Rethinagiri, S., Yalcin, G., Titos-Gil, R., Prieto, P., Torrella, E., Unsal, O., Cristal, A., Felber, P., Sobe, A., Hayduk, Y., Kurpicz, M., Fetzer, C., Knauth, T., Schneegass, M., Struckmeier, J., & Milojevic, D. (2016). The ParaDIME project. Design Automation and Test in Europe (DATE2016)
  6. 18. Maggioni, F. L. T., Oprins, H., Milojevic, D., Beyne, E., Wolf, I. D., & Baelmans, M. (2015). 3D-Convolution Based Fast Transient Thermal Model for 3D Integrated Circuits: Methodology and Applications. Thermal Measurement, Modeling Management Symposium (SEMI-THERM), 2015 31st, (pp. 107-112). doi:10.1109/SEMI-THERM.2015.7100148
  7. 19. Beece, A., Milojevic, D., Plas, G. V. D., Augur, R., Sureddin, M., Singh, J., Senapati, B., Bouche, G., Alapati, R., Stephens, J., Lin, I., Rashed, M., Yuan, L., Kye, J., Woo, Y., Wehbi, A., Hang, P., Ton-that, V., Kanagala, V., Yu, D., Gao, S., & Samavedam, S. (2015). Quantitative Projections of the Cost Benefits of 3D Integration. International Microelectronics Assembly and Packaging Society (IMAPS) 48th Conference
  8. 20. Milojevic, D. (2015). Advanced integration technologies: heterogeneous system design opportunities and challenges. Programmability: Programming Models for Large Scale Heterogeneous Systems, HIPEAC
  9. 21. Milojevic, D. (2015). 3D-Stacked Integrated Circuits: From technology to application. ARCHI2015
  10. 22. Agrawal, P., Milojevic, D., Raghavan, P., Catthoor, F., Van der Perre, L., Beyne, E., & Varadarajan, R. (2014). 2D vs 3D integration: Architecture-technology co-design for future mobile MPSoC platforms. Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2014 IEEE International (pp. 381-384). doi:10.1109/IITC.2014.6831839
  11. 23. Allard, Y., Nelissen, G., Goossens, J., & Milojevic, D. (2014). A context aware cache controller to bridge the gap between theory and practice in real-time systems. Embedded and Real-Time Computing Systems and Applications (RTCSA), 2014 IEEE 20th International Conference on (pp. 1-10). doi:10.1109/RTCSA.2014.6910503
  12. 24. Milojevic, D. (2013). Will 3D-IC Remain a Technology of the Futureldots Even in the Future? DATE 2013
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