Communications publiées lors de congrès ou colloques nationaux et internationaux (66)
2.
Calvacante, M., Agnesina, A., Riedel, S., Brunion, M., García-Ortiz, A., Milojevic, D., Catthoor, F., Lim, S. K., & Benini, L. L. (2022). MemPool-3D: Boosting Performance and Efficiency of Shared-L1 Memory Many-Core Clusters with 3D Integration. Proceedings of the 2022 (pp. 394-399) Design, Automation and Test in Europe Conference and Exhibition, DATE 2022.3.
Sisto, G., Chehab, B., Genneret, B., Rogier, B., Chen, R., Weckx, P., Ryckaert, J., Chou, R., Plas, G. V. D., Beyne, E., & Milojevic, D. (2021). IR-Drop Analysis of Hybrid Bonded 3D-ICs with Backside Power Delivery and μ-& N-TSVssi. 2021 IEEE International Interconnect Technology Conference (IITC) (2021-09-20) doi:10.1109/IITC51362.2021.95375414.
Sisto, G., Debacker, P., Ron, C. R., Van der Plas, G., Beyne, E., Richard, C. R., & Milojevic, D. (2020). Design enablement of fine pitch face-to-face 3D system integration using die-by-die place & route. IEEE 2019 International 3D Systems Integration Conference (2019-10-08) doi:10.1109/3DIC48104.2019.90589015.
Milojevic, D., Beyne, E., Plas, G. V. D., Wang, J. J., & Debacker, P. (2020). Cost-performance optimisation of fine-pitch W2W bonding: functional system partitioning with heterogeneous FEOL/BEOL configurations. SPIE Advanced Lithography (2020-02-20: San Jose, USA)