par Popov, Cyril;Plass, Martin;Zambov, Ludmil;Bulir, Jiri
;Delplancke, Marie-Paule
;Kulisch, Wilhelm
Référence Surface & coatings technology, 125, 1-3, page (278-283)
Publication Publié, 2000-03


Référence Surface & coatings technology, 125, 1-3, page (278-283)
Publication Publié, 2000-03
Article révisé par les pairs
Résumé : | Inductively coupled plasma chemical vapour deposition (ICP-CVD) has been used for the preparation of thin CNx films from a solid carbon source (at floating potential) and a nitrogen plasma. Volatile CN species generated via atomic transport reactions are the film forming particles. The deposited layers have a rather smooth surface; their deposition rate and thickness, respectively, depend on the substrate position due to a gradient in the precursor species concentration. The nitrogen fraction is at about 50% and exhibits almost no dependence on the deposition parameters. Emphasis was placed on a detailed study of the bonding structure by different analytical techniques. Based on these investigations, a probable structure of the CNx films is proposed. Since no identification of tetragonally bonded carbon atoms was found, it is supposed that the bonding network is composed of imine-like units and only to a small part of nitrile-type elements. The films are insulating with resistivity of up to 1011Ωcm. © 2000 Elsevier Science S.A. |