par Zhu, Lingjun;Bamberg, Lennart;Pentapati, Sai Surya Kiran;Chang, Kyungwook;Catthoor, Francky;Milojevic, Dragomir 
;Komalan, Manu;Cline, Brian;Sinha, Saurabh;Xu, Xiaoqing;García-Ortiz, Alberto;Lim, Sung Kyu
Référence IEEE transactions on very large scale integration (VLSI) systems, 29, 6, page (1152-1163), 9420273
Publication Publié, 2021-06-01
;Komalan, Manu;Cline, Brian;Sinha, Saurabh;Xu, Xiaoqing;García-Ortiz, Alberto;Lim, Sung KyuRéférence IEEE transactions on very large scale integration (VLSI) systems, 29, 6, page (1152-1163), 9420273
Publication Publié, 2021-06-01
Article révisé par les pairs
| Titre: |
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| Auteur: | Zhu, Lingjun; Bamberg, Lennart; Pentapati, Sai Surya Kiran; Chang, Kyungwook; Catthoor, Francky; Milojevic, Dragomir; Komalan, Manu; Cline, Brian; Sinha, Saurabh; Xu, Xiaoqing; García-Ortiz, Alberto; Lim, Sung Kyu |
| Informations sur la publication: | IEEE transactions on very large scale integration (VLSI) systems, 29, 6, page (1152-1163), 9420273 |
| Statut de publication: | Publié, 2021-06-01 |
| Sujet CREF: | Technologie informatique hardware |
| Informatique appliquée logiciel | |
| Electronique et électrotechnique | |
| Mots-clés: | Monolithic 3-D (M3-D) |
| physical design | |
| power delivery network (PDN) | |
| power integrity | |
| thermal analysis | |
| Note générale: | SCOPUS: ar.j |
| Langue: | Anglais |
| Identificateurs: | urn:issn:1063-8210 |
| info:doi/10.1109/TVLSI.2021.3073070 | |
| info:scp/85105038249 |
