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Establishing solder interconnects in capillary die-to-substrate self-assembly

par Mastrangeli, Massimo ;Ruythooren, Wouter;Van Hoof, Chris;Celis, J.-P
Référence 3D-SIC 2008(12-13 May 2008: Tokyo (JP)), International 3D System Integration Conference (3D-SIC 2008)
Publication Publié, 2008

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Résumé :

In this work, we seamlessly include the establishment of multiple lead-free solder interconnects as an integral part of capillary die self-assembly. We demonstrate the mechanical and electrical functionality of electrodeposited indium bumps as interconnects between substrate binding sites and assembled dies. Our results open interesting perspectives for widespread use of the technique for 3D die integration.