par Delplancke, Jean-Luc 
;Winand, René ;Dille, Jean ;Charlier, Jacques
Référence Materials Research Society symposia proceedings, 308, page (607-612)
Publication Publié, 1993
;Winand, René ;Dille, Jean ;Charlier, Jacques Référence Materials Research Society symposia proceedings, 308, page (607-612)
Publication Publié, 1993
Article révisé par les pairs
| Résumé : | Production of thin (10 to 200 microns thick) metallic (Cu, CO and Ni-P) foils is performed by electrodeposition on various substrates. A competition between substrate-induced and electroplating-induced inhibition of crystal growth appears. Films structures observed by SEM, TEM and X-Ray diffraction are related to the mechanical properties of the films (stress-strain curves, microhardness and working hardening bend test). In some cases, copper thin films with a large number of submicron crystals are obtained. These films recrystallize at room temperature and their mechanical properties are completely modified by this ageing process. |
