par Ku, Bon Woong;Debacker, Peter;Milojevic, Dragomir ;Raghavan, Praveen;Verkest, Diederik ;Thean, Aaron;Lim, Sung Kyu
Référence Proceedings of the 2016 International Symposium on Low Power Electronics and Design, ACM, page (76-81)
Publication Publié, 2016
Publication dans des actes
Titre:
  • Physical Design Solutions to Tackle FEOL/BEOL Degradation in Gate-level Monolithic 3D ICs
Auteur:Ku, Bon Woong; Debacker, Peter; Milojevic, Dragomir; Raghavan, Praveen; Verkest, Diederik; Thean, Aaron; Lim, Sung Kyu
Informations sur la publication:Proceedings of the 2016 International Symposium on Low Power Electronics and Design, ACM, page (76-81)
Statut de publication:Publié, 2016
series:ISLPED '16
Sujet CREF:Technologie informatique hardware
Technol. des composantes électroniques [microélectronique]
Mots-clés:FEOL/BEOL Degradation, Gate-level Monolithic 3D IC, Low Temperature Manufacturing Process
Langue:Anglais
Identificateurs:urn:isbn:978-1-4503-4185-1
info:doi/10.1145/2934583.2934622
http://doi.acm.org/10.1145/2934583.2934622