par Agrawal, P.;Milojevic, Dragomir ;Raghavan, P.;Catthoor, Francky;Van der Perre, Liesbet;Beyne, E.;Varadarajan, Ravi
Référence I E E E Embedded Systems Letters, 6, 4, page (85-88)
Publication Publié, 2014
Référence I E E E Embedded Systems Letters, 6, 4, page (85-88)
Publication Publié, 2014
Article révisé par les pairs
Titre: |
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Auteur: | Agrawal, P.; Milojevic, Dragomir; Raghavan, P.; Catthoor, Francky; Van der Perre, Liesbet; Beyne, E.; Varadarajan, Ravi |
Informations sur la publication: | I E E E Embedded Systems Letters, 6, 4, page (85-88) |
Statut de publication: | Publié, 2014 |
Sujet CREF: | Sciences de l'ingénieur |
Mots-clés: | mobile computing |
system-on-chip | |
3D integration technologies | |
3D partitioning | |
LTE | |
WLAN | |
interdie connection | |
mobile MPSoC platform | |
system level comparison | |
wireless PHY processing | |
Computer architecture | |
Copper | |
Integrated circuit interconnections | |
Multiprocessing systems | |
Three-dimensional integrated circuits | |
Through-silicon vias | |
3D stacked integrated circuits (3D-SIC) | |
Cu-Cu bonding | |
MPSoC | |
interconnect | |
through-silicon via (TSV) | |
Langue: | Anglais |
Identificateurs: | urn:issn:1943-0663 |
info:doi/10.1109/LES.2014.2360642 |