Titre :
  • System Level Comparison of 3D Integration Technologies for Future Mobile MPSoC Platform
Auteur : Agrawal, P. ; Milojevic, Dragomir ; Raghavan, P. ; Catthoor, Francky ; Van der Perre, Liesbet ; Beyne, E. ; Varadarajan, Ravi
Informations sur la publication : I E E E Embedded Systems Letters, 6, 4, (page 85-88)
Statut de publication : Publié, 2014
Sujet CREF : Sciences de l'ingénieur
Mots-clés : mobile computing
system-on-chip
3D integration technologies
3D partitioning
LTE
WLAN
interdie connection
mobile MPSoC platform
system level comparison
wireless PHY processing
Computer architecture
Copper
Integrated circuit interconnections
Multiprocessing systems
Three-dimensional integrated circuits
Through-silicon vias
3D stacked integrated circuits (3D-SIC)
Cu-Cu bonding
MPSoC
interconnect
through-silicon via (TSV)
Langue :
  • Anglais
Identificateurs : urn:issn:1943-0663 
info:doi/10.1109/LES.2014.2360642