par Agrawal, Prashant;Milojevic, Dragomir 
;Raghavan, P.;Catthoor, Francky;Van der Perre, Liesbet;Beyne, E.;Varadarajan, Ravi
Référence I E E E Embedded Systems Letters, 6, 4, page (85-88)
Publication Publié, 2014
;Raghavan, P.;Catthoor, Francky;Van der Perre, Liesbet;Beyne, E.;Varadarajan, RaviRéférence I E E E Embedded Systems Letters, 6, 4, page (85-88)
Publication Publié, 2014
Article révisé par les pairs
| Titre: |
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| Auteur: | Agrawal, Prashant; Milojevic, Dragomir; Raghavan, P.; Catthoor, Francky; Van der Perre, Liesbet; Beyne, E.; Varadarajan, Ravi |
| Informations sur la publication: | I E E E Embedded Systems Letters, 6, 4, page (85-88) |
| Statut de publication: | Publié, 2014 |
| Sujet CREF: | Sciences de l'ingénieur |
| Mots-clés: | mobile computing |
| system-on-chip | |
| 3D integration technologies | |
| 3D partitioning | |
| LTE | |
| WLAN | |
| interdie connection | |
| mobile MPSoC platform | |
| system level comparison | |
| wireless PHY processing | |
| Computer architecture | |
| Copper | |
| Integrated circuit interconnections | |
| Multiprocessing systems | |
| Three-dimensional integrated circuits | |
| Through-silicon vias | |
| 3D stacked integrated circuits (3D-SIC) | |
| Cu-Cu bonding | |
| MPSoC | |
| interconnect | |
| through-silicon via (TSV) | |
| Langue: | Anglais |
| Identificateurs: | urn:issn:1943-0663 |
| info:doi/10.1109/LES.2014.2360642 |
