par Beece, Adam;Milojevic, Dragomir 
;Plas, Geert Van der;Augur, Rod;Sureddin, Michelle;Singh, Jagar;Senapati, Biswanath;Bouche, Guillaume;Alapati, Ramakanth;Stephens, Jason;Lin, Irene;Rashed, Mahbub;Yuan, Lu;Kye, Jongwook;Woo, Youngtag;Wehbi, Ali;Hang, Peter;Ton-that, Van;Kanagala, Vijay;Yu, Donald;Gao, Shan;Samavedam, Srikant
Référence International Microelectronics Assembly and Packaging Society (IMAPS) 48th Conference
Publication Publié, 2015
;Plas, Geert Van der;Augur, Rod;Sureddin, Michelle;Singh, Jagar;Senapati, Biswanath;Bouche, Guillaume;Alapati, Ramakanth;Stephens, Jason;Lin, Irene;Rashed, Mahbub;Yuan, Lu;Kye, Jongwook;Woo, Youngtag;Wehbi, Ali;Hang, Peter;Ton-that, Van;Kanagala, Vijay;Yu, Donald;Gao, Shan;Samavedam, SrikantRéférence International Microelectronics Assembly and Packaging Society (IMAPS) 48th Conference
Publication Publié, 2015
Publication dans des actes
| Titre: |
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| Auteur: | Beece, Adam; Milojevic, Dragomir; Plas, Geert Van der; Augur, Rod; Sureddin, Michelle; Singh, Jagar; Senapati, Biswanath; Bouche, Guillaume; Alapati, Ramakanth; Stephens, Jason; Lin, Irene; Rashed, Mahbub; Yuan, Lu; Kye, Jongwook; Woo, Youngtag; Wehbi, Ali; Hang, Peter; Ton-that, Van; Kanagala, Vijay; Yu, Donald; Gao, Shan; Samavedam, Srikant |
| Informations sur la publication: | International Microelectronics Assembly and Packaging Society (IMAPS) 48th Conference |
| Statut de publication: | Publié, 2015 |
| Sujet CREF: | Sciences de l'ingénieur |
| Mots-clés: | Heterogeneous 3DIC, Cost modelling |
| Langue: | Anglais |
