par Beece, Adam;Milojevic, Dragomir ;Plas, Geert Van der;Augur, Rod;Sureddin, Michelle;Singh, Jagar;Senapati, Biswanath;Bouche, Guillaume;Alapati, Ramakanth;Stephens, Jason;Lin, Irene;Rashed, Mahbub;Yuan, Lu;Kye, Jongwook;Woo, Youngtag;Wehbi, Ali;Hang, Peter;Ton-that, Van;Kanagala, Vijay;Yu, Donald;Gao, Shan;Samavedam, Srikant
Référence International Microelectronics Assembly and Packaging Society (IMAPS) 48th Conference
Publication Publié, 2015
Référence International Microelectronics Assembly and Packaging Society (IMAPS) 48th Conference
Publication Publié, 2015
Publication dans des actes
Titre: |
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Auteur: | Beece, Adam; Milojevic, Dragomir; Plas, Geert Van der; Augur, Rod; Sureddin, Michelle; Singh, Jagar; Senapati, Biswanath; Bouche, Guillaume; Alapati, Ramakanth; Stephens, Jason; Lin, Irene; Rashed, Mahbub; Yuan, Lu; Kye, Jongwook; Woo, Youngtag; Wehbi, Ali; Hang, Peter; Ton-that, Van; Kanagala, Vijay; Yu, Donald; Gao, Shan; Samavedam, Srikant |
Informations sur la publication: | International Microelectronics Assembly and Packaging Society (IMAPS) 48th Conference |
Statut de publication: | Publié, 2015 |
Sujet CREF: | Sciences de l'ingénieur |
Mots-clés: | Heterogeneous 3DIC, Cost modelling |
Langue: | Anglais |