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Cyanide-free silver electrochemical deposition on copper and nickel

par Christophe, Jennifer ;Guilbert, G.;Rayee, Quentin ;Poelman, Mireille;Olivier, Marjorie;Buess Herman, Claudine
Référence Journal of the Electrochemical Society, 165, 14, page (D676-D680)
Publication Publié, 2018

Article révisé par les pairs

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Résumé :

Uracil was used as complexing agent to developp cyanide-free processes for silver deposition on copper and nickel substrates. We have highlighted that the molar ratio Ur/Ag+ between uracil and silver ions concentrations and the pH are crucial in the formulation of a stable and efficient bath and were found to be equal to 4 and 13.7 respectively. Silver was deposited in a single step on copper according to a three-dimensional nucleation mechanism while silver plating of nickel substrates was found to require an additionnal silver strike step. We worked out a choline chloride – oxalic acid DES-based silver solution which allowed to obtain bright, adherent and ductile silver coatings on Ni.