par Depinoy, Sylvain 
;Strepenne, François;Massart, Thierry,Jacques ;Godet, Stéphane ;Pardoen, Thomas
Référence Journal of the mechanics and physics of solids, 130, page (1-20)
Publication Publié, 2019-05-15
;Strepenne, François;Massart, Thierry,Jacques ;Godet, Stéphane ;Pardoen, ThomasRéférence Journal of the mechanics and physics of solids, 130, page (1-20)
Publication Publié, 2019-05-15
Article révisé par les pairs
| Résumé : | The effect on an interlayer on the toughness of an interface between a ductile thin film and an elastic substrate is investigated by finite element modeling and assessed towards experimental measurements. The model is based on an asymptotic K -field formulation re- lying on cohesive zone elements to simulate the fracture process. A compliant interlayer tends to increase the interface toughness by promoting plastic dissipation in the thin layer. Additional toughening can result from the development of plastic strains in the inter- layer. The magnitude of these two toughening mechanisms depends on the film thick- ness, among other parameters. The model predictions are confirmed by comparison with wedge-opening test data performed on a multilayer composed of a thin Cu layer and a polymer interlayer embedded between two stainless steel substrates. These findings lay the foundation for the design of tougher multilayers and provide a critical assessment of experimental protocols for interface toughness measurements requiring the bonding of a dummy substrate, such as used for DCB or four point bending tests. |
