par Mulay, Shantanu S.S.;Becker, Gauthier;Vayrette, Renaud;Raskin, Jean-Pierre;Pardoen, Thomas;Galceran Mestres, Montserrat 
;Godet, Stéphane
Référence 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013(14 April 2013 through 17 April 2013; Code 98040: Wroclaw; Poland), 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013
Publication Publié, 2013
;Godet, Stéphane Référence 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013(14 April 2013 through 17 April 2013; Code 98040: Wroclaw; Poland), 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013
Publication Publié, 2013
Publication dans des actes
| Titre: |
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| Auteur: | Mulay, Shantanu S.S.; Becker, Gauthier; Vayrette, Renaud; Raskin, Jean-Pierre; Pardoen, Thomas; Galceran Mestres, Montserrat; Godet, Stéphane |
| Informations sur la publication: | 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013(14 April 2013 through 17 April 2013; Code 98040: Wroclaw; Poland), 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013 |
| Statut de publication: | Publié, 2013 |
| Sujet CREF: | Sciences de l'ingénieur |
| Note générale: | SCOPUS: cp.c |
| Langue: | Anglais |
| Identificateurs: | urn:isbn:978-146736138-5 |
| info:doi/10.1109/EuroSimE.2013.6529898 | |
| info:scp/84880986950 |
