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2D vs 3D integration: Architecture-technology co-design for future mobile MPSoC platforms

par Agrawal, Prashant;Milojevic, Dragomir ;Raghavan, P.;Catthoor, Francky;Van der Perre, Liesbet;Beyne, Eric;Varadarajan, Ravi
Référence Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2014 IEEE International, page (381-384)
Publication Publié, 2014

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Titre:	2D vs 3D integration: Architecture-technology co-design for future mobile MPSoC platforms
Auteur:	Agrawal, Prashant; Milojevic, Dragomir; Raghavan, P.; Catthoor, Francky; Van der Perre, Liesbet; Beyne, Eric; Varadarajan, Ravi
Informations sur la publication:	Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2014 IEEE International, page (381-384)
Statut de publication:	Publié, 2014
Sujet CREF:	Sciences de l'ingénieur
Mots-clés:	integrated circuit interconnections
	memory architecture
	system-on-chip
	three-dimensional integrated circuits
	2D integration
	3D integration
	3D stacked IC
	3D-SIC
	LTE
	WLAN
	architecture-technology co-design
	data memory organization
	memory-on-logic
	mobile MPSoC platforms
	system architecture level
	wireless PHY processing
	Integrated circuit interconnections
	Memory management
	Organizations
	Three-dimensional displays
	Wireless communication
	Wires
Langue:	Anglais
Identificateurs:	info:doi/10.1109/IITC.2014.6831839