par Agrawal, P.;Milojevic, Dragomir 
;Raghavan, P.;Catthoor, Francky;Van der Perre, Liesbet;Beyne, E.;Varadarajan, Ravi
Référence Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2014 IEEE International, page (381-384)
Publication Publié, 2014
;Raghavan, P.;Catthoor, Francky;Van der Perre, Liesbet;Beyne, E.;Varadarajan, RaviRéférence Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2014 IEEE International, page (381-384)
Publication Publié, 2014
Publication dans des actes
| Titre: |
|
| Auteur: | Agrawal, P.; Milojevic, Dragomir; Raghavan, P.; Catthoor, Francky; Van der Perre, Liesbet; Beyne, E.; Varadarajan, Ravi |
| Informations sur la publication: | Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2014 IEEE International, page (381-384) |
| Statut de publication: | Publié, 2014 |
| Sujet CREF: | Sciences de l'ingénieur |
| Mots-clés: | integrated circuit interconnections |
| memory architecture | |
| system-on-chip | |
| three-dimensional integrated circuits | |
| 2D integration | |
| 3D integration | |
| 3D stacked IC | |
| 3D-SIC | |
| LTE | |
| WLAN | |
| architecture-technology co-design | |
| data memory organization | |
| memory-on-logic | |
| mobile MPSoC platforms | |
| system architecture level | |
| wireless PHY processing | |
| Integrated circuit interconnections | |
| Memory management | |
| Organizations | |
| Three-dimensional displays | |
| Wireless communication | |
| Wires | |
| Langue: | Anglais |
| Identificateurs: | info:doi/10.1109/IITC.2014.6831839 |
