par Agrawal, P.; Milojevic, Dragomir Liste de publications; Raghavan, P.; Catthoor, Francky; Van der Perre, Liesbet; Beyne, E.; Varadarajan, Ravi
Référence Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2014 IEEE International, (page 381-384)
Publication Publié, 2014
Publication dans des actes
Titre :
  • 2D vs 3D integration: Architecture-technology co-design for future mobile MPSoC platforms
Auteur : Agrawal, P. ; Milojevic, Dragomir ; Raghavan, P. ; Catthoor, Francky ; Van der Perre, Liesbet ; Beyne, E. ; Varadarajan, Ravi
Statut de publication : Publié, 2014
Sujet CREF : Sciences de l'ingénieur
Informations sur la publication :
  • Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2014 IEEE International, page 381-384
Mots-clés : integrated circuit interconnections
memory architecture
system-on-chip
three-dimensional integrated circuits
2D integration
3D integration
3D stacked IC
3D-SIC
LTE
WLAN
architecture-technology co-design
data memory organization
memory-on-logic
mobile MPSoC platforms
system architecture level
wireless PHY processing
Integrated circuit interconnections
Memory management
Organizations
Three-dimensional displays
Wireless communication
Wires
Langue :
  • Anglais
Identificateurs : info:doi/10.1109/IITC.2014.6831839